What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and accelerators closer together, 3D-ICs overcome data-movement bottlenecks and ...

3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization ...