Unlike their mid-century ancestors, today's plastics are being reimagined through ultra-thin layering at the molecular level.

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...

Researchers from Skoltech and Harbin Institute of Technology have devised and tested a new mechanism for joining together the composite parts that make up bridges, the cooling towers of power stations ...

A recent advance in the science of hydrogen fuel production could enable higher output and more sustainable production of ...

Polyester and a host of other plastic products could potentially be manufactured with non-toxic and sustainable BPA ...

Wide-scale adoption of this technology would be a drastic departure for those who have relied on trial-and-error, but the ...

Discover how Dow and Lear are revolutionizing the automotive industry with a new lightweight seat cushion. Learn about the ...

A global collaboration including Sunwoda, Chery, Nobel laureate M. Stanley Whittingham, Semitronix, the University of ...

Every bit of technology fails eventually, whether time, wear-and-tear, adverse conditions, or perhaps a mixture of all three ...

Merino Industries Ltd. concluded its participation at the Architectural Digest Design Show 2025 in Mumbai and Hyderabad with ...

Materials informatics combines data analytics and engineering design, streamlining material development and enhancing performance through AI integration.